After a period of quietness, COB packaging technology has gradually been applied by many manufacturers, but there are still some problems to be solved. (1) Selection of substrate: The heat dissipation performance of the substrate plays a key role in the heat conduction of the entire package system. (2) Selection of package adhesive: Package adhesive has a great influence on COB package and other LED package forms. (3) Chip selection: The chip is not only related to the light efficiency of the entire LED, but also has a great relationship with heat dissipation. (4) Design and application of the overall heat dissipation structure: There are many heat dissipation structures that can be used in the COB package, but the design of these structures is based on the improved heat dissipation structure originally proposed. There are still many problems to be solved in the actual production of these heat dissipation structures. Shenzhen Liyang Optoelectronics Co., Ltd. (hereinafter referred to as "Liyang Shares") completed the research and development of the kilowatt COB light source packaging process in October this year to effectively solve the above problems. It is understood that the technology of Liyang is through the research and development of the technical research project of the Shenzhen Science and Technology Innovation Committee of 2016, which focuses on the research and development of key technologies for high-power LED multi-core integrated light source modules based on flip-chip technology. R & D. According to the relevant person in charge of Liyang Co., the technology is based on the company's mature flip-chip process, using aluminum nitride ceramic substrate (or copper substrate), without bond wire package. The use of flip chip and the removal of the bonding wires have enabled the product to be thinned, and the LED product failure caused by the short wires of the bonding wires has been completely eliminated. The gold-free wire package completely eliminates many reliability problems caused by the bond alloy wire, and the dead light rate of the lamp is reduced. At the same time, using 3D automatic printing technology, eutectic welding. The professional cavity rate monitoring equipment monitors the whole process to improve the yield rate; the white light technology is applied by pulse spray phosphor to improve the product quality; and the multi-chip array integrated package heat sink structure design. In addition, support for large current input, up to 1.5 times the equivalent of the formal product; low thermal resistance, Rthj-s <0.03 ° C / w; luminous efficiency of 110Lm / W. The kilowatt-level COB light source packaging process has simple structure and process, maximizes the advantages of heat conduction of each structure, and has good thermal conductivity and superior thermal resistance structure, which is more suitable for application of ultra-high current and high-density light source, thereby being better applicable. The need for indoor and outdoor high-power lamps. The project's products are independently researched and developed by Liyang Co., and the current research and development results are applied for two patent protections. Has applied for invention patent 201710879498.7 "a super-power COB light source and production process" and utility model patent 201721238590.7 "a super-power COB light source". After the light source is put on the market, due to its small size and high power, it provides a new choice for the transformation of traditional lamps. In addition, the thermal resistance structure is more suitable for the application of ultra-high current and high-density light source, and the heat dissipation effect is good. Based on the technological leadership of the "kilowatt COB light source packaging process", Liyang shares decided to use this technology to compete for the "Innovation Technology Award of the 2017 (8th) High-tech LED Golden Globe Awards". In addition to competing for the annual Innovation Technology Award, the "T5050RGBW" series of products that Liyang Co., Ltd. completed in April this year will also participate in the annual innovation award competition. T5050RGBW The T5050RGBW has an ultra-low thermal resistance. The use of ultra-high-conductivity aluminum nitride substrate as LED carrier provides good channel for heat conduction; vertical wafer has always been the most superior in LED wafer, and high-conductivity solid-crystal silver paste is used to make the wafer and substrate more firm and hot. The channel is smoother and the LED light source has a thermal resistance as low as 3 ° C / w. Secondly, the optical properties are excellent. The light is derived from a primary light distribution lens with high transparency, which is convenient for subsequent lamp design and can be better applied to stage and lighting fixtures. T5050RGBW increases product stability by reducing product thermal resistance. A single device can drive to higher power (4W-8W), reducing customer cost of ownership. This product has a high brightness, high luminous efficiency, ultra-thin packaging, small size and good color consistency, and is a very competitive product. About Liyang Liyang Co., Ltd. (stock code: 838452)--Shenzhen Liyang Optoelectronics Co., Ltd. was founded in 2008. It is a leading listed company in the research, production and sales of LED packaging device products. The Group's business is mainly focused on the LED packaging industry. The business covers the entire LED lighting industry chain: from LED light sources to LED luminaires to integrated LED lighting solutions. As a leader in packaging technology and solutions in the entire LED lighting value chain, Liyang has relied on its own team of experienced senior technical experts to independently develop high-power, high-efficiency and high-stability based on independent innovation and research and development of flip-chip packaging technology. LED light source products, through continuous optimization and in-depth research, to achieve continuous improvement and innovation of LED packaging products, has always been committed to solving the key technical problems in the LED flip-chip industrialization process. With the tenet of “Technology Innovation and Quality Firstâ€, Liyang Co., Ltd. adheres to the philosophy of “creating the sustainable development of LED green lighting and creating maximum value for customersâ€, adheres to the principle of quality, innovation, dedication and win-win, and adheres to the high quality product line. Production of packaged lamp beads: EMC3535 series, ceramic 3535 series, inverted and formal integrated COB light source series, SMD/3030/5050/7070 series, ceramic 3535RGB/5050RGBW series, etc., to provide customers with LED light source, LED lighting module and LED lighting Products, based on the advantages of independent LED packaging, create a series of products with patent guarantee and high added value. FTTH Fiber Optical Fast Connectors
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