Semiconductor material shouted

The Japanese government demanded that the Hamaoka nuclear power plant be shut down and that Japanese semiconductor material suppliers in the resumption of work would be worse. Industry pointed out that Japan's lack of electricity in the summer will lead to lower than expected material supply, including the growth of semiconductor materials such as silicon wafers, silver paste, and epoxy resins. The increase in the second and third quarters is expected to reach 20-30%.

Japan closed the Hamaoka nuclear power plant, and Chubu Electric could not use surplus power to support summer electricity in the Kanto and northeast.

According to Huang Jianeng, chairman of the leading domestic packaging material supply company, Huadian Electric, the material shortage problem that has emerged after the Japan Earthquake has already surfaced, and the material cost will increase in full price. If the benchmark is based on Japanese currency, at least a 10-20% increase in price is required. Some of the material price increases are already in progress, including silver glue, epoxy resin, lead frames, and so on.

Due to the serious damage to the equipment of Japanese suppliers during the earthquake, during the next resumption of work, they encountered summer power restrictions, and the supply side has experienced problems. Therefore, price increases are inevitable.

According to industry insiders, from the perspective of the semiconductor production chain, the upstream wafer fab mainly solves the problem that silicon wafers are out of stock. Although SUMCO, MEMC, and Shin-Etsu Semiconductor have all resumed their work, the summer The power cut problem is likely to be caused by the closure of the Hamaoka nuclear power plant by Chubu Power, which will result in tighter power supply in the Kanto and Tohoku areas.

In order to fear that after the peak season, there will not be enough supply of silicon wafers. Semiconductor manufacturers in Taiwan, Japan, and South Korea will actively pull orders, and wafer prices will naturally increase. The industry will evaluate the second quarter and third quarter gains. Fear up to 10 to 15%.

As for the problems faced by the packaging plant, the main problem is the shortage of critical chemical materials. In addition to the previous supply shortage of BT resin, the key includes silver paste, epoxy resin, lead frame, solder mask, etc. The material supplier also failed to fully recover its production capacity due to more upstream chemical materials. Until the end of June, it could not return to the pre-earthquake supply.

In the third quarter of the summer, after the peak period of electricity consumption, the Japanese government demanded that Kanto and Northeastern regions need to reduce their electricity consumption by 20 to 25%. Now that Central Power is unable to support excess electricity, the supply of chemical materials will naturally not be able to produce full capacity. Therefore, the price increase of packaging materials is now in progress, and the price increase in the second quarter to the third quarter is as high as 20 to 30%.