This paper proposes a MEMS-based LED chip packaging technology, which uses the groove formed on the silicon substrate by the bulk silicon process as the reflective cavity of the packaged LED chip. The influence of the reflection cavity on the luminous intensity and beam performance of the LED is analyzed. The analysis results show that the reflection cavity can improve the luminous efficiency and beam performance of the chip. The relationship between the structural parameters of the reflective cavity and the luminous efficiency of the chip is discussed. Finally, the process flow of the r package is designed. The package structure can reduce the package size of the chip and improve the luminous efficiency and heat dissipation characteristics of the device. Figure 1 LED T1 or T1—3/4 After decades of development, LED performance has been greatly improved. Because of its high luminous efficiency, small size and long life, it will become a new generation of illumination source, which is recognized as the field of illumination after incandescent lamps. Another major revolution. At present, LED has been widely used in many fields such as lighting, decoration, display and automobile, and its application prospects and application fields are still being continuously developed and expanded. In the LED industry chain, packaging is a very important part, which determines the characteristics of the LED chip's light, heat, life and secondary light distribution. The initial package form of the LED is mainly T1 and T1—3/4 as shown in Fig. 1. With the improvement of the chip's luminous power and the expansion of the application field, its original package structure no longer meets the needs of LED development in terms of heat dissipation or integration. With the continuous development of electronic packaging technology, surface mount (SMT) packaging technology has become the mainstream of LED packaging technology. The device based on SMT technology is called SMD. The surface mounted SMD-LED is integrated, heat dissipation and reliable. Sex E is much better than the previous package structure. (a) LED package based on lead frame (b) LED chip attached to PEB board Figure 2 SMD-LED At present, the SMT-based LED package mainly uses a structure formed by a lead frame and a molding compound as a package base of the chip, and the lead frame functions as a heat conduction and an electrode lead: the molding compound serves as a support structure, and its structure is as shown in FIG. 2 . (a) is shown. Due to the complexity of this structure, it is limited that it cannot be made very small. Therefore, for smaller packages (eg, SMD0603, SMl30402), the LED chips are usually mounted directly on the PEB board, as shown in Figure 2(b). Since this structure has no reflection cavity, its luminous efficiency is very low; another problem with this structure is that the thermal conductivity of the PCB is poor, for example, the thermal conductivity of FR4 is only 0.3 W/k. This will limit the operating power of the high brightness LED. With the continuous improvement of the integration of electronic products, the packaging and production of small-sized LEDs needs to be larger and larger. Therefore, this paper proposes a silicon-based LEO chip packaging technology combined with MEMS technology. The utility model has the advantages of small package size, and at the same time solves the defects of low luminous efficiency and high thermal resistance caused by directly mounting the chip on the PEB. Firstly, the influence of the reflection cavity on the luminous efficiency of the LED chip is discussed. The relationship between the structural parameters of the reflective cavity and the luminous efficiency of the LED is analyzed in detail. Finally, the packaging process flow is designed.
Design specifications
Material body: ABS Surface finishing: injected color
Material blade: Stainless steel Material bowl: SAN
Material jar: Glass or Plastic Disc storage: Yes
Dishwasher attachments: Yes Cord storage:Yes
Approvals
GS/CE/CB/LVD/EMC/ROHS/LFGB/DGCCRF/REACH/ERP
Parts
A: Body with chopping bowl
B: 1.5 litre Glass Wet Mill attachment
1.5 litre Plastic Wet Mill attachment
C: Dry Mill attachment with filter lid
D: Citrus juicer
E: Centrifugal juicer
F: Metal twin geared whisk
G: 0.5 litre small chopping bowl and blade
H: Plastic chopping blade
Stainless steel chopping blade
I: Spatula
J: Plastic holder with Shred Disc, fine & rough Julienne Disc
Slicer Disc
K. Cubic disc
Blender Food Mixer,Digital Control Juice Blender ,Multifunction Stand Mixer ,Machine Food Mixer Housoen Electric Manufacture Co., Ltd. , https://www.housoenappliances.com
