Most of the virtual reality heads are just peripherals for smartphones or PC screens, so it is sometimes easy to forget that HoloLens itself actually contains complete PC components and specialized SoCs, and can perform millions of assessments of the external world on a sustainable basis. And the task of generating virtual overlay images. This of course generates a lot of heat, but because Microsoft's products have a good thermal engineering design, we rarely see users complain about this problem. A patent issued by the U.S. Patent and Trademark Office a few days ago allows us to understand Microsoft's technology. Microsoft has developed a custom flexible heat pipe that transfers heat from the chipset to the "cooling channels" in the headband. This patent shows that flexible heat pipes constructed of a thin layer of thermally conductive material (e.g. metal or graphite) will be connected to one another but not fixed, allowing a degree of movement to effectively transfer heat from one area to another. Although Microsoft specifically applies this technology to HoloLens, it can also be used on laptops to transfer the heat of basic components to the screen because the screen usually has a larger area of ​​radiating surface and thus can achieve more effective passive cooling without the need for Use a fan.
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Newly-published patents reveal HoloLens thermal engineering design
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New Published Patent Reveals HoloLens Thermal Thermal Engineering Design from Baidu VR