(Cannes, France – October 8, 2014) The CDFP Multi-Source Agreement (MSA) is a serious release of the CDFP 2.0 Interoperable Hot-Swap Module Specification. Designed for resource-intensive applications in telecom, network, and enterprise computing environments, the CDFP interface delivers data at a rate of 25 Gbps per line over a single module over 16 lines, or 400 Gbps. It also has excellent signal integrity, thermal cooling properties, and EMI protection.
CDFP MSA's founding and sponsoring organizations include: Avago Technologies, Brocade Communications, IBM, JD, Juniper Networks, Molex, and Tyco Electronics. Actively participating member companies include: FCI, Finisa, Huawei, Inphi, Idacom, Mellanox Technologies, Zhengling Seiko, Oranjo, Shengte, Sumitomo Electric, Xilinx, and Shanyi Electric. The CDFP MSA was established in 2013 with the goal of defining specifications and promoting it in the industry, and has announced that it has successfully achieved its goals, completing the mechanical drawing design and deepening the design specifications for the CDFP 2.0 module.
The CDFP 400 Gbps interface provides an extremely high level of integration, outstanding performance and long-term reliability, while offering both short and long versions. The specification is also compatible with in-line cables, active optical cables, and connected optical modules. The CDFP module is designed for client interfaces inside the data center for extremely high port density. The modular design makes it ideal for low power applications based on copper, VCSEL or silicon optoelectronics. The CDFP module is expected to be used in industry standards up to 100 m MMF and 2 km length SMF. For example, a CDFP module can be used for a 400 Gbps interface, or sixteen interfaces with a rate of 25 Gbps or four interfaces with a rate of 100 Gbps.
The full specification of the CDFP 2.0 Interoperable Hot Plug Module and a free white paper entitled "CDFP Today's Implementation of 400 Gbps" are available from the CDFP MSA home page.
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